25 December 2020

 

Electroless Nickel Process

Ginplate NI 4320 AutoP Process (Midphos ENP)

  • Self-pH-Regulating process
  • Robust and Hybrid buffer system
  • Good plating Speed (15 – 22 µ/hr)
  • Phosphorous content (4.5 – 8.5% w/w)
  • Mirror bright finish
  • Long bath life (10 MTO)
  • Low operating cost
  • Good wear and abrasion resistance
  • Robust buffer system
  • Pits and roughness free coating up to 10 mills
  • Good bath stability
  • Suitable for plating on a wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy
  • P-Content may be fine-tuned and controlled as per requirements of jobs.
  • Non-Magnetic Deposit (<8.5% P-content)

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