25 December 2020
Electroless Nickel Process
Ginplate NI 4320 AutoP Process (Midphos ENP)
- Self-pH-Regulating process
- Robust and Hybrid buffer system
- Good plating Speed (15 – 22 µ/hr)
- Phosphorous content (4.5 – 8.5% w/w)
- Mirror bright finish
- Long bath life (10 MTO)
- Low operating cost
- Good wear and abrasion resistance
- Robust buffer system
- Pits and roughness free coating up to 10 mills
- Good bath stability
- Suitable for plating on a wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy
- P-Content may be fine-tuned and controlled as per requirements of jobs.
- Non-Magnetic Deposit (<8.5% P-content)
