Electroless Nickel Process for POP

Ginsol NI 614 ABS Process

• Suitable for ABS and PC-ABS Blend
• Compressive Stress
• RoHS
• Good Ductility
• Excellent bath solution stability
• Robust buffer and stabilizer system
• Good adhesion to properly prepare the non-conducting surface
• Low consumption rate
• Excellent coating coverage
• Minimal Porosity
• Good Plating Speed
• Longer bath life