Cadmium-Lead Free, Mid-phos Electroless Nickel (EN) process

Cuprobrite 3009 brightener system

• Cadmium – Lead Free.
• Fast plating Speed.
• Self-regulating pH.
• Hybrid buffer system.
• Low organic and Sulphate.
• Good Corrosion Resistance.
• Compressive Stress.
• RoHS.
• Minimal Porosity at Thicknesses of >0.4 Mil.
• Good Wear and Abrasion Resistance.
• Long bath life.
• Suitable for plating on wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy.
• Magnetic Deposit (6.0 to 8.5% P-content).
• Non-Magnetic Deposit (> 8.5% P-content).

Mid-phos Electroless Nickel (EN) process (Matt Finish)

Gromatt EN 609 CLF

• Cadmium – Lead Free.
• Fast plating Speed.
• Low Nickel (5 g/L),
• Low temperature (80 °C).
• Hybrid buffer system.
• Meets ROHS and REACH compliant.
• Minimal Porosity at Thicknesses of >0.4 Mil.
• Good Wear and Abrasion Resistance.
• Compressive Stress.
• Long bath life.
• Matt finish.
• Suitable for plating on wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy.
• Magnetic Deposit (< 8.5 % P-content).

Mid-phos Electroless Nickel (EN) process (Black Passivation)

GrowNoir EN Passivation

• Comply with RoHS Compliance
• Provides a black passivated conversion coating on electroless Ni-P alloy
• Good corrosion and wear resistance without sealer.
• High absorption coefficient
• Good thermal and electrical conductivity
• Good scratch resistance