Electronics and PCB

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Electronics and PCB

Growel, a pioneering force in India's metal finishing domain, manufactures an extensive range of chemicals required for plating on electronics. We have seven decades’ market presence, robust in-plant experience, specialized analytical infrastructure, and plant engineering. We possess the capabilities to analyze your needs and offer tailored insights, recommend processing steps and plant layouts that will meet your specific requirements.

Process Product Description
TIN PLATING ALKALINE SATIN TIN SALT Growel's Satin tin salt is an RoHS-compliant alkaline solution specially compounded for both vat and barrel plating applications. The alkaline satin tin process functions at an elevated temperature of up to 80°C, resulting in a smooth, non-porous matte finish, making it ideal for electrical components. Features and benefits: Extremely high throwing power Simple to operate and maintain Suitable for plating on fabricated components
GINTRON STANNOLUME BRIGHT ACID TIN Nitrate and cyanide-free immersion silver plating process with a deposition rate of This process utilizes a distinctive blend of carrier additive and brightener to create a mirror-bright, silvery-white deposit. Features and benefits: Deposit exhibits low porosity, excellent solderability, ductility, and corrosion resistance Meets strict specifications set for the electronic and electrical industries
GINTRON TINNOMATTE ACID TIN Sulphate-based acid tin process with a 2-part brightener system that produces electrodeposits with a pleasant, crystalline, and silvery-white matte finish. The easy-to-maintain electrolyte is highly stable during idle periods. Features and benefits: Wide plating range Excellent plating solution stability Electrodeposits with outstanding ductility and solderability Suitable for use in plating of terminals, connectors, and bus bars
GINTRON TINNOMATTE MT 100 Revolutionary single additive sulphate-based acid tin process that produces electrodeposits with a dull and silky matte finish. Features and benefits: High stability of plating solution Exceptional ductility and solderability Suitable for plating of terminals, connectors, and bus bars
HIGH SPEED MSA-BASED TIN PLATING GINTRON STANNOBRITE SN 21 (BRIGHT) RoHS compliant chemistry that produces attractive, pure bright tin deposit for exposed sheet metal parts. This fluoborate-free low foaming, reel-to-reel plating process is ideal for strips, wires, connectors and lead frames plating. Being free from fluoborate and corrosive sulfuric acid also makes the effluent easy to treat, thus simplifying the process. Simple analysis is sufficient for process control.
GINTRON STANNOMATTE SOLDER 319 (MATTE) Growel's Stannomatte Solder 319 produces pure tin matte deposits with minimal carbon content and outstanding reflow characteristics. These fine-grained deposits are achieved through a specialized grain refiner and exhibit exceptional ductility and solderability, rivalling that of lead-containing tin alloys.
SILVER PLATING PROCESSES GINTRON SILVA IM - IMMERSION SILVER Protects board from oxidation and improves service life Suitable for press fit SMD application for HDI boards, fine pitch components/BGA Shelf life: >1 year, passes 2-3 reflow cycles
SILVERGLOW NC 203 - ELECTROLYTIC HARD SILVER Cyanide-free Deposit hardness: 150-200 hv Suitable for contacting surface - improves service life
TIN ALLOY PLATING PROCESSES Lead-free; ideal for solder cap applications on copper posts, designed for flip chip technology. Perfect for fine pitch applications (50-100 μ): our process ensures impeccable soldering capabilities and robust electronic connections. GINTRON STANNOMATTE SOLDER SN BI: Produces dull, silky Tin-Bismuth coatings (Bi: up to 10%) GINTRON STANNOMATTE SOLDER SN AG: Produces fine crystalline, matte tin-silver coatings (Ag: up to 5%)
Deflash GINTRON CHEMICAL DEFLASH: 100% concentration at 70-90°C. Applied through dipping, followed by water jet spray.

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Process Product Description
Sweller Gintron MLB 495 Prepares the dielectric for a clean, micro-roughened, and micro-porous through-hole topography in multilayer PCBs. Essential for achieving optimal three-pin connections
PERMANGANATE ETCH GINTRON MLB 498 Transforms manganese compound residues into a soluble state on board surface and hole walls. Cleans the surface effectively Removes copper oxides from copper surfaces to enhance copper-to-copper bonding
REDUCTION Gintron MLB 495 Prepares the dielectric for a clean, micro-roughened, and micro-porous through-hole topography in multilayer PCBs. Essential for achieving optimal three-pin connections

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Process Product Description
Cleaning/Conditioning Gintron CC 5725 Removes oil, soils, fingerprints, and drilling debris. Prepares the PCB surface before black oxide, solder mask, and other pre-treatment processes. Enhances adhesion of electroless copper on hole and promotes coverage without voids across the hole wall.
Gintron CC 50 Cleans and uniformly etches copper surfaces without affecting the dielectric. Offers controlled etching action and ensures a prolonged solution life..
Pre-activation Gintron PC 236 Controlled acidity makes it suitable for use in through-hole plating of multilayer boards.
Gintron Additive 443 Single-step tin-palladium solution for exceptional electroless copper coverage and adhesion within holes and on the copper surface of drilled boards.
Activation Gintron Activator 444 Highly concentrated single-step tin-palladium colloidal solution for outstanding electroless copper coverage and improved adhesion within holes and on the copper surface of PCBs..
Reduction Gintron PA 491/493 Improves initial deposition rate of electroless copper thus ensuring uniform and strong electroless copper bonding to the laminate.
Electroless Copper >Gintron Cu 406 Stable room temperature electroless copper bath for low build PCB processing. Produces bright, dense, fine-grained rose-pink deposits..
Gintron Cu 703 Innovative, stable, high-speed electroless copper plating (deposits 2.0-3.0 microns in 30 min). Yields bright pink, ductile deposits, aiding in convenient through-hole coverage inspection.
Anti-tarnish Gintek Cu 56 Protects copper circuits from tarnish and corrosion during storage. Boosts solderability at room temperature. Easily removable with alkaline solutions.

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Process Product Description
Acid Cleaner Gintron AD 482 Acidic liquid cleaner for cleaning, conditioning, and activation of copper surfaces. Maintains compatibility with most resist materials..
Gintron PC 455 Acidic cleaner that effectively removes aqueous binder residues from dry film photoresist on copper tracks before PCB pattern plating. Does not compromise integrity of the photoresist.
Gintron PC 458 Liquid acid cleaner that boosts the receptivity of electroless copper-plated surfaces. Streamlines the direct application of plating resist, ensuring superior adhesion without the need for pre-scrubbing or etching.
Microetch Gintron AD 481 Cleans and uniformly etches copper surfaces without affecting the dielectric. Offers controlled etching action and ensures a prolonged solution life.
Acid Copper Gintron Cu 944 Single additive acid copper plating system for PCB fabrication; especially those with high density circuits and high aspect ratios. Produces highly ductile & uniform deposits with a thickness ratio of 1:1 on surface to hole wall.
Gintron Cu 945 High Throw High throw ductile bright acid copper process specially designed for through-hole plating. Single additive; making it stable, easy to operate, and economical. Can be operated at over 40°C to increase bath speed.
Cuprobrite HT High throw ductile, stable, easy to operate and economical, bright acid copper plating process for through-hole plating. Employs single additive.
Acid Tin Stannolume (Brightener + Carrier Additive) Sulphate-based bright tin process that employs a unique combination of carrier additive and brightener to produce mirror bright, silvery white deposits with excellent solderability and ductility.

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Process Product Description
Acid Cleaner (ENIG & ENEPIG) Gintron AD 482 Acidic liquid cleaner for cleaning, conditioning, and activation of copper surfaces. Maintains compatibility with most resist materials
Microetch (ENIG & ENEPIG) Gintron AD 481 Cleans and uniformly etches copper surfaces without affecting the dielectric. Offers controlled etching action and ensures a prolonged solution life.
Electroless Nickel (ENIG & ENEPIG) Gintron Ni SEP 9304 Deposits semi-bright nickel phosphorus (P: 4-7%) uniformly. Ensures good bonding and solderability. Ideal for PCB plating (deposit thickness of 4-6 μm)
Electroless Palladium (ENEPIG) Gintron PD 106 Applies cost-effective pure palladium deposit via autocatalytic electroless plating, enhancing corrosion resistance and soldering ability without the 'black pad effect' compared to ENIG process. This process can be followed by a Nickel Sulphamate (18%) bath - an excellent barrier layer before gold plating, which prevents copper migration for boards without finger contact.
Immersion Gold (ENIG & ENEPIG) Aurowell IM Self-limiting process for SMT PCBs (HASL-free option) that ensures an extremely flat surface, excellent solderability, and bonding. Deposit thickness: 0.05-0.10 μm.

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Process Product Description
Cleaner Gintron AD 482 Acidic liquid cleaner for cleaning, conditioning, and activation of copper surfaces. Maintains compatibility with most resist materials.
Microetch Gintron AD 481 Cleans and uniformly etches copper surfaces without affecting the dielectric. Offers controlled etching action and ensures a prolonged solution life.
Predip Gintron Predip Controlled acidity makes it suitable for use in through-hole plating of multilayer boards.
Tin bath Gintek SN Cyanide-free immersion tin-plating process designed for SMT PCBS (HASL-free). Deposits 0.65-1.3 μm in 10-20 minutes. Produces lead-free, dense, and corrosion - resistant tin deposits with enhanced solderability.

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Process Product Description
Oxide replacement Gintron MB 438 Unique black copper oxide that enhances inner layer bond strength in MLB fabrication. Resists thermal degradation during reflow, hot air levelling, or wave soldering and improves solder mask adhesion in SMOBC processes.
Cyanide-free Immersion Silver Growel Silva IM Process Nitrate and cyanide-free immersion silver plating process with a deposition rate of 0.4-0.6 μm/20 minutes. Sustains electrical conductivity and solderability even when exposed to heat, pollution, and humidity.
Organic Solderability Preservative Gintron Plus OSP for SMT PCBs; cost-effective alternative to immersion Tin, ENIG, and ENEPIG.
Smear removal Gictane 70 Replaces hydrofluoric acid in etch-back applications. Aids in dissolving or etching fibreglass fibres efficiently.
HAL pre-treatment Solderex 641 Innovative flux formulation for treating PCBs with hot air levelled tin-lead coating. Water-soluble & biodegradable. Ensures uniform coating in hot air levelling, offering excellent solder wetting to copper. Easy application via spray or roller process.
ML bonding enhancer Gibonol C Oxidizer for copper foils in multilayer laminates. Enhances bond strength between copper foil and dielectric substrates.

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