03 January 2020

 

Electroless Nickel Process for POP

Ginsol NI 614 ABS Process

  • Suitable for ABS and PC-ABS Blend
  • Compressive Stress
  • RoHS
  • Good Ductility
  • Excellent bath solution stability
  • Robust buffer and stabilizer system
  • Good adhesion to properly prepare the non-conducting surface
  • Low consumption rate
  • Excellent coating coverage
  • Minimal Porosity
  • Good Plating Speed
  • Longer bath life

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