16 November 2018

Cadmium-Lead Free, Mid-phos Electroless Nickel (EN) process

Cuprobrite 3009 brightener system

  • Cadmium – Lead Free.
  • Fast plating Speed.
  • Self-regulating pH.
  • Hybrid buffer system.
  • Low organic and Sulphate.
  • Good Corrosion Resistance.
  • Compressive Stress.
  • RoHS.
  • Minimal Porosity at Thicknesses of >0.4 Mil.
  • Good Wear and Abrasion Resistance.
  • Long bath life.
  • Suitable for plating on wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy.
  • Magnetic Deposit (6.0 to 8.5% P-content).
  • Non-Magnetic Deposit (> 8.5% P-content).

Mid-phos Electroless Nickel (EN) process (Matt Finish)

Gromatt EN 609 CLF

  • Cadmium – Lead Free.
  • Fast plating Speed.
  • Low Nickel (5 g/L),
  • Low temperature (80 °C).
  • Hybrid buffer system.
  • Meets ROHS and REACH compliant.
  • Minimal Porosity at Thicknesses of >0.4 Mil.
  • Good Wear and Abrasion Resistance.
  • Compressive Stress.
  • Long bath life.
  • Matt finish.
  • Suitable for plating on wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy.
  • Magnetic Deposit (< 8.5 % P-content).

Mid-phos Electroless Nickel (EN) process (Black Passivation)

GrowNoir EN Passivation

  • Comply with RoHS Compliance
  • Provides a black passivated conversion coating on electroless Ni-P alloy
  • Good corrosion and wear resistance without sealer.
  • High absorption coefficient
  • Good thermal and electrical conductivity
  • Good scratch resistance

 

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