Introducing Ginsol-NI-801 / Ginplate Ni CL2 / Ginplast Ni 801 specially formulated for Plating on Plastics

It is a highly stable chloride-based alkaline Electroless Nickel Process, specially formulated to rapidly deposit uniform, defect-free, and well-conductive Ni-P layers on properly prepared ABS, PC- ABS blend, and other non-conductor substrates.

Features:

• New generation alkaline ENP process for plating on plastic based on chloride based ingredient’s.
• Specially designed to plate thin, adherent, 1^st layer of conductive ENP layer on ABS &/or PC-ABS blend.
• Doesn’t contain any harmful raw materials e,g. lead, cadmium etc.
• Unmatched bath stability on account of higher solubility of involved additives & thus, offers very long bath life - Can be operated till the 125 g/L Orthophosphite.
• Being lower grain sizes, it provides coating without any ‘voids’.

Benefits:

• Uniform & bright continuous coating.
• Conforms the recent industry norms e,g ROHS, ELV etc.
• Lesser rejections pertaining to pitting &/or voids.
• Longer bath life – lower consumption of chemicals which in turn reduces the cost of operation.
• Brighter coating – better aesthetics.
• Increased through-put.