Introduction of new range of RoHS Highphos Electroless Nickel processes

Ginplate Ni 825

• Self-pH-Regulating process
• Excellent corrosion and wear resistance
• High phosphorous Electroless Nickel system that provides semi bright deposit.
• Provides Higher & consistent plating speed (10-14 m/hr) with consistent and uniform alloy distribution (P-content 10 to13 wt%)
• Longer bath life (6-8 MTO) with excellent bath solution stability
• Ductile coating enable post plating fabrication
• Suitable for High thickness Build-up Applications (>10 Mils)
• Minimal Porosity at Thicknesses of >0.4 Mil
• Narrow Melting Temperature, Suitable for Brazing and Welding
• Suitable for automobile, petrochemical, aerospace Industries, nuclear and engineering applications
  
  

Introduction of new range of RoHS Midphos-Lowphos Dual Electroless Nickel process

Ginplate Ni Nanoadamas 101

• It is just a two component product, one Electroless nickel part and another for Nano diamond emulsion part for both the makeup and the replenishment.  
• Lead Cadmium Free RoHS product
• Self-pH-Regulating process
• Exceptional wear resistance property with enhance corrosion protection
• Phosphorous content (4.5 – 8.5% w/w)
• Provides Higher & consistent plating speed (8 – 12 mm/hr) with uniform distribution of Ni-P alloy and Nano diamond particles in the matrix.
• Longer bath life (6 MTO) with excellent bath solution stability
• Wide window of operating pH (4.5 – 7.0) and Temperature (55 – 90 °C)
• Suitable for plating on wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy
• It is proven to be advantageous for the industries like textile, molding cutting and grinding tools, die, petrochemical and automotive industries.

Introduction of new range of RoHS Midphos-Lowphos Dual Electroless Nickel process

Ginplate Ni Uniramous 225 CLF

• Just a single product to place order, bring and stock at the plant for two variant (MP-LP) of Electroless Nickel plating
• Lead Cadmium Free RoHS product
• Self-pH-Regulating process
• Excellent wear resistance property
• Provides Higher & consistent plating speed (10- 22 mm/hr) with consistent and uniform alloy distribution of your choice (P-content 2 to 8 to13 wt%)
• Longer bath life (10-15 MTO) with excellent bath solution stability
• Ductile coating enable post plating fabrication
• Suitable for High thickness Build-up Applications (>10 Mils)
• Wide window of operating pH (4.5 – 7.0) and Temperature (55 – 90 °C)
• It can be operated at Neutral pH and comparatively lower temperature (55 – 60 °C)
• Good conductivity, Narrow Melting and Solderability make it suitable for electronics and electrical applications.