Electroless Nickel Process

Ginplate NI 4320 AutoP Process (Midphos ENP)

• Self-pH-Regulating process
• Robust and Hybrid buffer system
• Good plating Speed (15 – 22 µ/hr)
• Phosphorous content (4.5 – 8.5% w/w)
• Mirror bright finish
• Long bath life (10 MTO)
• Low operating cost
• Good wear and abrasion resistance
• Robust buffer system
• Pits and roughness free coating up to 10 mills
• Good bath stability
• Suitable for plating on a wide variety of substrates, SS, MS, CS, Cu alloy & Al alloy
• P-Content may be fine-tuned and controlled as per requirements of jobs.
• Non-Magnetic Deposit (<8.5% P-content)