Acid Copper Description Gintron Cu 944 Single additive acid copper plating system for PCB fabrication; especially those with high density circuits and high aspect ratios. Produces highly ductile & uniform deposits with a thickness ratio of 1:1 on surface to hole wall. Gintron Cu 945 High Throw High throw ductile bright acid copper process specially designed for through-hole plating. Single additive; making it stable, easy to operate, and economical. Can be operated at over 40°C to increase bath speed. Cuprobrite HT High throw ductile, stable, easy to operate and economical, bright acid copper plating process for through-hole plating. Employs single additive. get a quote
