Pre-Treatment Cleaners Pickling Agents / Additives General Plating Brass Cadmium Chrome Copper Electroless Nickel Nickel Plating on Aluminium Antique Finishes Plating on Plastics Tin & Tin Alloys Zinc & Zinc Alloys Conversion Coating Anodising Phosphating & Nano Ceramic Coatings PCB & Electronics PCB & Electronics PCB & Electronics Lacquers ElectroPhoretic Lacquers Precious Metal Nickel Free Technology White Metal Technology Silver Gold Intermediates Copper Plating Additives Miscellaneous Additives Nickel-Plating-Additives Zinc Plating Additives Strippers Strippers Continuous Plating Chemicals Fluxes Inhibitor Passivation Cleaners Protective Post Treatment Protective Post Treatment Blackening & Basic Chemicals Blackening Basic Chemicals Zinc Flake Coatings Dacromet / Geomet Process Chemicals / General Plating / Copper Copper Copper electro-deposition has variety of applications in metal finishing, primarily: An undercoat for surface finishes such as Nickel Chromium on steel, aluminium, zinc base diecastings and plating grade plastics (ABS & ABS PC). As a base for oxidized or coloured finishes. In electronics for production of printed circuit boards and printing cylinders. Electroforming of precision components and moulds. Thick deposits applied on steel as a stop-off coating in case of hardening processes such as carborising and nitriding. Copper can be plated from a variety of solutions cyanide, acid sulphate and more recently fluobo rate based. Copper Plating Acid Copper Cuprobrite Bright Copper ProcessA sulphate based acid Copper bath to produce highly levelled brilliant smooth and ductile deposits. Covering and throwing power of this bath are substantially high due to special additives. Especially recommended as an undercoat to Nickel Chrome systems for plating on ABS plastics and zinc based diecastings.Cuprobrack 2005Bright acid Copper plating process which produces highly levelled, brilliant, smooth and ductile deposits. This process is designed to produce uniform brightness at wide current density levels. It is specially formulated for decorative plating on metals and plastic parts.Cuprobrite 1502, 1503 & 1504 ProcessThis is a unique aqueous dye based acid Copper plating process. It produces brilliant, highly levelled Copper deposits which are a perfect match to micro crystalline structure of bright Nickel deposit. It achieves uniform leveling on all current density areas, allowing to plate complicated articles. The process is compatible for broad range of Nickel brightener systems and is most suitable for Nickel free jewellery plating which needs exceptionally levelled Copper deposits.Cuprobrite 1512, 1513 & 1514Acid Copper brightener system with good levelling & brighteness most suitable for plating on plastics.Cuprobrite 702 & 703 / 1702 & 1703Twin additive, highly concentrated, fully aqueous bright acid copper plating process. It imparts brightness even at lower current densities.Cuprobrite 3006 / 3008 / 4006 / 310 / 3010 ProcessInnovative Copper brightener system suitable for excellent glossiness. This process can also be chosen for Copper-Nickel-Chrome combination irrespective of thickness of coatings.Cuprobrite DF 412, 413 & 414 Copper Plating ProcessFully aqueous dye free plating process to oer glossy pit free Copper deposits. This process is specially designed for plating of ABS plastics. Cyanide Copper Cyno / Cyco Dull Copper ProcessGeneral purpose baths for Copper strike as well as heavy deposits of cyanide Copper whenever desired. Suitable for rack as well as barrel operation, the system provides a fine grain layer of Copper.Rochelle Copper / Cuprabond ProcessThis process is recommended for high rate of fine grained deposition. The deposit obtained is specially recommended for Zinc based diecastings and Aluminium.Cuproglo Copper ProcessCuproglo cyanide copper process produces extremely fine grained ductile and semi-bright deposits at high cathode eciency, deposits 1 micron / min.Cuproglo Composite Brightener 35An auxiliary additive to be used in cyanide Copper plating process to improve brightness, also helps in reducing ‘fuming’ during process.Fume Reducer 84Can be added to cyanide Copper bath to produce a foam blanket to avoid fuming during process. High Build Copper Cuprabuild HS 900 / Cupraback IPSpecially designed acid Copper plating process for high thickness build-ups for applications such as printing cylinders, copper bottom vessels etc. It builds higher thickness without any internal stresses. Fine grained micro structure imparts moderate hardness values upto 120 VHN. The deposit is semi-bright & extremely smooth. Non-Cyanide Alkaline Copper Cuprobrite NC Plating ProcessAlkaline Copper plating process to eliminate usage of cyanides in the process, could be chosen to provide strike deposits on ferrous or non ferrous e.g, Zinc based die-castings, Aluminum, Magnesium etc. This process is now used as strike coating prior to hard Chrome plating on printing cylinders/Tin/Silver plating on Aluminum bus bars. Pyroglo Copper Plating ProcessCyanide free pyrophosphate based Copper plating process with excellent throwing power. Hence, it could be chosen variety of applications - decorative plating of faucets, thru-hole plating of PCB's etc. Product line contains all desired product categories - dull / semi - bright & glossy deposits resembling that of acid copper. Suitable "to be used for dicult to plate substrates" e.g. Zinc based die-casting with deep low current areas etc. Close X Know More DISCLAIMER : Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these product s are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.