PCB & Electronics

Chemicals For Printed Circuit Boards
The Ginplate range of process chemicals are designed for manufacture of single sided, double sided and multilayer thruhole plated PC boards to provide unique advantages such as superior end-product quality, process reliability, ease of operational control and economy.

Ginplate MLB 495
Ginplate MLB 495 predisposes dielectric to exhibit a clean micro-roughened, micro-porous thru-hole topography of multilayer PCB. It is used prior to permanganate base etch back process, to achieve perfect three pin connection.

Ginplate MLB 497
Ginplate MLB 497 is based on permanganate chemis- try, providing controlled attack on organic substrate. This removes presensitized dielectric materials from inner layer and hole wall surfaces creating 3-point connection sites for inner layers. It also provides microporous resin topography ideally suited for excel- lent adhesion of subsequent Copper plating.

Ginplate MLB 498
Effectively reduces all Manganese compound residues on board surfaces and hole walls to a soluble state and the surface is left ultra-clean. Unwanted Copper oxides are also removed from surface to promote optimum Copper to Copper bonding. Glass etching additive can also be incorporated if desired.

Ginplate MB 438
This is a unique, versatile back Copper oxide system; has a unique initiator that ensures uniform colour of the oxide. It also improves bond strength of inner layer in fabrication on MLB, to resist thermal degradation during reflow, hot air levelling or wave soldering. It increases the bond strength of solder masks used in SMOBC process.

Ginplate CC 5725
New generation cleaner / conditioner for PCB through hole plating, allowing 100% optical coverage of electroless Copper plating, virtually allowing pin-hole-free electroless Copper coverage when observed at 80% magnification.

Ginplate CC 50
A mildly alkaline liquid cleaner especially formulated for effective soak cleaning of printed circuit boards to remove tarnish, soils, finger prints and drilling debris from the holes. It conditions the hole wall to facilitate uniform activation, thus promotes a uniform fine grained adherent deposit from subsequent Ginplate electroless Copper bath.

Ginplate PC 453
An alkaline cleaner which removes oil, soils, finger prints and drilling debris. This is a general purpose cleaner for PCBs, used for surface preparation before black oxide; solder mask applications and such PCB pretreatment processes.

Ginplate AD 482
An acidic cleaner used to clean, condition and activate Copper surfaces prior to pattern plating. It removes binder residues of broad range dry film photo resist after developing and prior to pattern plating operations.

Ginplate PC 455
An ideal acidic liquid cleaner designed to remove photo resist binder residues from Copper surfaces of printed circuit boards.

Ginplate Cu 406
Highly stable, room temperature low build, electroless Copper plating bath designed for processing of printed circuit boards to impart bright, dense, fine grained deposits rosy pink in colour and facilitates easy inspection of thruholes after plating.

Ginplate Cu 703
Stable, high build, electroless Copper plating process, operating at 40-42°C, produces fine grained, ductile, electroless Copper deposit on conditioned / catalysed thruhole wall of PCBs, also facilitates higher rate of production.

Ginplate Cu 701
Highly stable, room temperature, medium build, electroless Copper plating bath for PCBs, highly economical process having easy operation control.

Cuprobrite HT Process
High throw ductile stable, easy to operate and economical, bright acid Copper plating process, specially designed for through-hole plating in printed circuit industry, employs single additive.

Ginplate CU 945 / 944
A contemporary single additive acid Copper plating system for PCB fabrication especially designed to be used in manufacture of Printed Circuit Boards with high density circuits and high aspect ratios. Copper deposit is highly ductile and uniform having thickness ratio of 1:1 on surface to hole wall, capable of withstanding multiple thermal shock cycles conforming to international standards.

Stannolume Acid Tin Process
The Stannolume bright Tin process employs unique combination of carrier additive and brightener to produce mirror bright, silvery white deposits having excellent solderability and ductility characteristics and meeting stringent specifications demanded by electronic and electrical industries.

Sopal-64 Process
Designed specially for PCB applications to produce satin finishes of Tin Lead alloys, plating around eutectic ratio of 63% Tin-37% lead, exhibiting excellent solderability and shelf life. The alloy deposits can be reflowed to bright alloy by hot oil.

Ginplate AD 481
Provides clean, uniformly etched Copper surfaces, without affecting dielectric, using persulphate based material, resulting in controlled etching action and long solution life.

Ginplate E 2743
Economical hydrogen peroxide sulphuric acid etchant; replaces costly persulphate baths, controls etch rate and inhibits decomposition of hydrogen peroxide in closed loop regeneration system to reduce waste treatment costs.

Ginplate PC 236
A powdered product mixed with hydrochloric acid to prepare a pre-dip solution prior to activation in Ginplate Activator 444 solution; has controlled acidity thereby ideally suitable for thru-hole plating of multi- layer boards.

Ginplate Activator 444
An advanced single step, highly concentrated Tin Palla- dium colloidal solution to promote superb electroless Copper coverage and better adhesion in holes as well as on copper surface of printed Circuit Boards. Due to its peculiar property of small colloidal size, it can be operated at lower acidity facilitation process of multi- layer PCBs to avoid pink ring phenomenon.

Ginplate PA 493
Improves initial deposition rate of subsequent electro- less Copper, promoting dense, fine grained deposits, ensures uniform, strong bonding of electroless Copper deposits to Copper laminate and
consistently good coverage of electroless Copper in plated thru-holes.

Immersion Gold For PCB (Aurowel)
Self limiting Gold process specially designed for SMT PCB’s (HASL free option); plates from 0.03 to 0.10 micron of Gold over freshly deposited electroless Nickel. Provides extremely flat topography, having excellent solderability & bondability.

Gintek SN
Gintek SN immersion Tin plating process specially designed for SMT PCB’s (HASL free option), plates from 0.65 to 1.3 micron of Tin over Copper providing extremely flat topography having excellent solderabil- ity & bond ability.

Ginplate AG
An innovative immersion Silver plating process.

Gintek Plus
Organic surface preservative mainly designed for surface mount technology printed circuit boards to protect Copper circuitary over a long period and offers flat coatings that are compatible with various fluxes for surface mounting of electronic components.

Metstrip TL 142
Specially stabilised formulation used with hydrogen peroxide for rapid single step stripping of Solder and other Tin alloys from Copper clad printed circuit boards. This is a hydrogen peroxide based stripper having minimum attack on base Copper and can hold  more  Tin  or  Lead  content  without  affecting performance.

Growstrip TL 1000
A fluoride free non-exothermic stripper for Tin / Tin Lead alloy from Copper without sludge formation and fumes, can be used as spray or dip application.

Growstrip TL 3000 SP
Mild exothermic Tin, Tin-Lead stripper for PCB, by spray application, providing short dwell time over long bath life span, allowing negligible Copper etching.