Electroless Copper

Gintron Cu 406

Stable room temperature electroless copper bath for low build PCB processing. Produces bright, dense, fine-grained rose-pink deposits.

 

Gintron Cu 703

Innovative, stable, high-speed electroless copper plating (deposits 2.0-3.0 microns in 30 min). Yields bright pink, ductile deposits, aiding in convenient through-hole coverage inspection.

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DISCLAIMER :

Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these products are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.


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