Pre-Treatment Cleaners Pickling Agents / Additives General Plating Brass Cadmium Chrome Copper Electroless Nickel Nickel Plating on Aluminium Antique Finishes Plating on Plastics Tin & Tin Alloys Zinc & Zinc Alloys Conversion Coating Anodising Phosphating & Nano Ceramic Coatings PCB & Electronics PCB & Electronics Lacquers ElectroPhoretic Lacquers Precious Metal Nickel Free Technology White Metal Technology Silver Gold Intermediates Copper Plating Additives Miscellaneous Additives Nickel-Plating-Additives Zinc Plating Additives Strippers Strippers Continuous Plating Chemicals Fluxes Inhibitor Passivation Cleaners Protective Post Treatment Protective Post Treatment Blackening & Basic Chemicals Blackening Basic Chemicals Zinc Flake Coatings Dacromet / Geomet Process Chemicals / General Plating / Electroless Nickel Electroless Nickel Electroless Nickel plating is a process of plating Nickel phosphorous alloy by chemical reduction on catalytic metal surface without electricity. These deposits have properties which generally are functional. Deposits from electroless Nickel processes are highly corrosion resistant and have low porosity, feasible to achieve excellent hardness close to that of hard Chromium after heat treatment, outstanding wear and abrasion resistance and uniformity of thickness. Electroless Nickel Electroless Ni Nano Composite Electroless Ni-P coatings with nano materials like Boron carbide, Boron nitride, PTFE, Silicon Carbide, Tungsten, diamonds, etc provide further tuning of surface properties like hardness, wear resistance, friction, etc.Ginplate NI 380Stable, high PTFE composite electroless Nickel process with excellent bath stability, applicable to wide range of substrates. Deposits uniform PTFE at 20-35% by volume.Ginplate NI 411Electroless Nickel composite plating process which incorporates PTFE at 7-12% by volume as occluded particle in the plated deposit. High Phosphorous Ginplate NI 422 / 425High phosphorous, stable, medium speed electroless Nickel deposits that have excellent corrosion resistance, elongation and low stress, good for heavy deposit build-ups. Low Phosphorous Ginplate Ni 426Unique low phosphorous (1 - 3%) electroless Nickel plating process. Medium Phosphorous Ginplate NI 418 / 431Medium phosphorous electroless Nickel deposits are extremely stable, high speed, bright to very bright; economical to operate.Ginplate NI 4180Medium phosphorous electroless Nickel plating with excellent brightness.Ginplate NI 432Medium phosphorous electroless Nickel process ~ for faster deposition. Ginplate NI SEP 9304Specially designed for production of SMT PCB’s, provides flat topography, excellent solderability & bond ability. Compatible with wide range of soldermasks.Ginplate NI 618Revolutionary electroless Nickel plating process offers higher rate of deposition with whiter tone, generates low build-up of unwanted break down products extending bath life of operating solution. This process also permits more ‘metal turn-over’ to the operating solution making it economical in usage. ROHS Compliant High Phosphorous Ginplate NI 522High phosphorous semi bright electroless Nickel for ROHS compliance. Ginplate NI 625Advanced RoHS electroless nickel process designed to produce deposits exhibiting superior performance in engineering and functional applications. ROHS Compliant Medium Phosphorous Ginplate NI 435Medium phosphorous semi bright to bright electroless Nickel process–Complies ROHS directives. Ginplate NI 632New highly stable, high speed electroless Nickel process especially designed as per RoHS compliance for economical operation and good corrosion protection. Close X Know More DISCLAIMER : Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these product s are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.