Electroless Palladium (ENEPIG)

Gintron PD 106

Applies cost-effective pure palladium deposit via autocatalytic electroless plating, enhancing corrosion resistance and soldering ability without the 'black pad effect' compared to ENIG process.

This process can be followed by a Nickel Sulphamate (18%) bath - an excellent barrier layer before gold plating, which prevents copper migration for boards without finger contact.

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Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these products are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.


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