GINSOL CU 803 (POP)

Highly stable electroless copper plating process with a higher rate of deposition & broad ‘working window’ stable up to 900 deg C.

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Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these products are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.


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