Ginsol-NI-801 / Ginplate Ni Cl2

It is a highly stable chloride-based alkaline Electroless Nickel Process, specially formulated to rapidly deposit uniform, defect-free, and well-conductive Ni-P layers on properly prepared ABS, PC- ABS blend, and other non-conductor substrates.

 

Salient Features:

  1. It has better solution stability due to higher dissolution of Chloride ions
  2. High Metal Turnover (MTO) due to low rate of Orthophosphate bi-product formation
  3. Faster and better coverage due to higher plating speed
  4. Wide window of bath-operating parameters (Temp. 30 to 45 deg, pH - 8.5 to 9.0)
  5. It meets the requirement of most of the regulatory compliances (eg- RoHS, REACH, ELVs etc.)

 

Industries: Automobile

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DISCLAIMER :

Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these products are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.


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