With increasing industrial usage of parts made of plastics, application for plating on plastics is limitless. As manufacturers increasingly look to plastic as an answer to lighter, more corrosion resistant, less expensive products. Future of plated plastics is promising. Ideal plastic material for plating purpose is ABS (acrylonitrile butadiene styrene).
Ginplate PC 452 Non-silicate mild alkaline soak degreaser system, efficiently removes soils and grease even at lower concentration.Ginplate CC-50 ABS This is a mild alkaline liquid product for effective clean- ing of plastic materials to remove soils and finger marks, also a unique conditioner with anti-static properties. It may be used either as immersion or in spray mode. It is also recommended as pretreatment step for painting on plastics.Ginplate CC-30 ABSThis is a mild alkaline liquid product specially formu- lated for effective cleaning as also conditioning of plastic materials prior to painting. As a cleaner, it removes soils and finger marks. It eliminates static charge on the plastic surfaces and aids in quick drying, making it amenable for painting in subsequent steps.Ginplate Conditioner 474Strong chromic acid based micro chemical etching system for good adhesion on plastics. Avoids mechanical roughening.Ginplate Enviroetch Environment friendly, chrome-free, OSHA compliant room temperature etchant for plastics. It creates a hydrophilic and micro-roughened surface that is necessary for good adherence of subsequently plated metal layers.Ginplate Reducer CRReducing agent after etching, improves bath life of activator; based on organic additives, does not affect surface condition of chemically etched plastic substrates.Ginplate Reducer CR (AF)Ammonia free reducing agent after etching, improves bath life of activator.Ginplate Activator 442 / 444High effective single-step easy to handle Palladium - Tin colloid with smaller particle size, specially designed to metallise plastic prior to electro- deposition.
Ginsol Activator UltraHighly efficient Palladium - Tin colloid process for ABS / ABS-PC parts with very good tolerance towards other incoming contaminants e.g, Chromium etc, Built in with high Palladium content coupled with smaller particle size provides good compact pore free coverage deposit. Specially designed to be used in automatic processing lines. Operating baths are quite stable, hence lower reduces over all consumption of chemicals.Ginsol AcceleratorReduces Palladium to its metallic stage, promotes subsequent initial nucleation of electroless Nickel or Copper.Ginplate GK 12 / 120Sulfuric, hydrochloric acid free product to reduce Palladium to its metallic stage & facilitates subsequent fine nucleation of electroless Nickel or Copper.Ginplate CU 803Highly stable electroless Copper plating process, with faster rate of deposition with broad working window, stable even up to 90°C.Ginplate NI 414 / 414 (ABS) Electroless Nickel process to impart uniform conduc- tive ‘pit-free’ semi-bright electroless Nickel base coat on activated plastic surface. Ammonia consumption in this system is lower than its contemporary products.Ginsol NI 601Room temperature electroless Nickel process with enhanced bath life, suitable for manual / automatic plating installations; imparting uniform conductive pit-free semi-bright electroless Nickel base coat on activated plastic surface.Ginsol Conductor HD This is an alkaline Copper containing solution, which is applied in place of traditional accelerator & electroless Nickel / Copper plating after Ginsol / Ginplate Activa- tor to offer to the users option of direct plating. It shortens line length and also eliminates plating rejections pertaining to that of electroless depositions.Ginsol PrecodipThis is a specialised surface preparation process after electroless Nickel prior to acid Copper plating elimi- nating need of strike Nickel deposit. It improves conductivity of electroless Nickel deposit eliminating chances of high current burning & dissolution of deposited immersion coating and thereby, plating rejections of void spots, ideal choice for plating of multipurpose mix components.Cuprobrite / Cuprobrac Acid Copper Acid Copper plating process having wide brightening range with excellent levelling; suitable for higher deposit thickness, allows its usage even at higher temperature.
Spectra / Unispec Bright NickelBroad range of products are available with superb brightness and levelling, meeting customer’s needs - both technical and commercial. Ductolite Multilayer Nickel process provides very high corrosion resistance.Durobrite SRHS / Durocrack Chrome Salt Mixed catalysed Chrome plating process, provides desired ‘bluish’ look. Room temperature operation option is also feasible with some variant.
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