TIN ALLOY PLATING PROCESSES

Lead-free; ideal for solder cap applications on copper posts, designed for flip chip technology. Perfect for fine pitch applications (50-100 μ): our process ensures impeccable soldering capabilities and robust electronic connections.

GINTRON STANNOMATTE SOLDER SN BI: Produces dull, silky Tin-Bismuth coatings (Bi: up to 10%)

GINTRON STANNOMATTE SOLDER SN AG: Produces fine crystalline, matte tin-silver coatings (Ag: up to 5%)

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DISCLAIMER :

Our recommendations are made in good faith and are based on our skills. However , since the conditions of use of these products are beyond our control, this information is given on the express condition and agreement that Grauer & Weil (India) Limited, will not be liable to any person by reason thereof. Nothing herein shall be deemed to be a recommendation to use any product in violation of any existing patent rights.


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